R&D PROJECTS

Development of Integrated Electronics Circuits and Systems

An R&D collaborative project undertaken by Electronic Devices, Circuits and Systems Laboratory (electrolab), for NanoZeta Technologies Ltd., with the aim to develop a novel power management unit. CAS lab is responsible for the design of the LDOs and the DC-DC buck converters.

SOLDER

Members of the group are participating in the FP7 research project SOLDER

The goal of SOLDER is to develop a new spectrum overlay technology, which will provide the efficient aggregation of non-continuous dispersed spectrum bands licensed to heterogeneous networks (HetNets) and heterogeneous Radio Access Technology (h-RATs).

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EMOSIC

Members of the group are participating in the NSRF 2007-2013, National Action: Cooperation, research project EMOSIC

EMOSIC - An E-band / mmwave CMOS RFIC/MMIC implementation for future private networks and mobile backhaul radio applications

EUROPRACTICE STIMULATION PROGRAM for FIRST USERS of chip design in standard IC and advanced IC technologies

Our aim is to implement CA techniques to provide extended bandwidth by aggregating up to five component carriers (CCs), where each CC could carry 5-20 MHz of bandwidth. Thus, an aggregated total bandwidth up to 100 MHz can be provided on a single chip with an initial target of maximum 5 CCs.

The design and implementation of this RF front-end ASIC is part of a multiband, adaptive, radio-frequency (RF) transceiver architecture for carrier aggregation, providing (i) interband contiguous and non-contiguous intra-band CA with the capability to receive and transmit up to three carriers simultaneously, (ii) both time-division duplex (TDD) and frequency-division duplex (FDD) modes, while demonstrating (iii) CA between licensed and unlicensed bands, (iv) MIMO capabilities and finally, (v) employing energy detection for spectrum sensing.